Engineering Simulation Solutions Leader Brings Together Product Innovators this August
ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced its hallmark event, the 2008 International ANSYS Conference. A must-attend event for executives, managers and technical staff in a wide range of industries, the conference is scheduled for August 26 to 28 at the David L. Lawrence Convention Center in Pittsburgh, Pennsylvania, U.S.A.
This is the 14th conference that ANSYS has staged since its inaugural event in 1983. During the last two decades, as simulation has become a critical element of the product development process, the content, breadth of technology and attendance of the International ANSYS Conference has grown as well. Companies from around the world, in a wide range of industries, are planning to attend the 2008 event. More than 800 people attended the last conference, held in 2006. ANSYS also will be hosting an analyst day in conjunction with the conference on August 26 for financial and industry analysts.
The International ANSYS Conference brings together engineers, analysts and management from all disciplines of simulation to learn about the future of engineering design simulation and analysis. Themed “Inspiring Engineering,” this year’s conference will showcase how global, innovative companies use engineering simulation to inspire their engineering designs, resulting in improved products and processes. The conference will demonstrate how the ANSYS vision and its powerful technologies meet the ever-changing needs of users who demand integrated, automated, scalable and multidisciplinary tools. In addition, participants will have the opportunity to see and hear how future capabilities from ANSYS will impact the industry, to try out the hands-on preview, and to exchange ideas with ANSYS team members, industry experts and colleagues from companies throughout the world.
“We believe simulation leads to inspired engineering. It powers the product innovation engine,” said Jim Cashman, president and CEO of ANSYS, Inc. “We see evidence of this every day as we engage with our customers around the world. Companies successful at leveraging simulation throughout the product development process have a distinct advantage in an increasingly competitive global environment. The conference is a great opportunity for all of us to learn about the unique ways customers are innovating through Simulation Driven Product Development™.”
The 2008 International ANSYS Conference will feature dynamic keynote presentations, technical sessions, management sessions, ANSYS Solves topics (which provide an inside look at the latest technologies from ANSYS and how this technology can be applied to help ensure success), and vendor exhibitions.
Keynote conference speakers will discuss the use of simulation as a vehicle for inspired engineering design:
- James E. Cashman III, President and Chief Executive Officer, ANSYS, Inc.: perspectives on the ANSYS vision for Simulation Driven Product Development
- Dipankar Choudhury, Vice President, Corporate Product Strategy and Planning, ANSYS, Inc.: product plans and roadmap
- Willem Toet, Head of Aerodynamics, BMW Sauber F1: strategic utilization of CFD for competitive advantage in automotive racing
- Jerry Young, Director, Materials and Structures Technology, Boeing – Phantom Works: challenges for advanced simulation in aerospace product development
Technical sessions will detail how product development professionals in specific industries and application areas have deployed simulation technology in their design process: academic, aerospace and defense, biomedical, chemicals, civil engineering, consumer products, electronics, knowledge management, large-scale analysis, materials processing, multiphysics simulation, nuclear power, oil and gas, optimization and Design for Six Sigma, power generation, semiconductors, sustainable and green technologies, and turbomachinery.
To highlight managerial concerns, a management roundtable will host a panel discussion at which innovative, successful and visionary ANSYS customers share how they have applied simulation technology to achieve significant success within their global organizations. This panel discussion, themed “Inspiring Engineering with Simulation,” is a chance for attendees to hear from — and pose questions to — a diverse group of managers from leading global organizations, including Becton, Dickinson and Company; The Dow Chemical Company; Goodrich Corporation; Texas Instruments Incorporated; and Whirlpool Corporation.
A second roundtable discussion featuring thought leaders in high-performance computing (HPC) will examine how significant advances in HPC create an opportunity for ANSYS customers to improve their overall ROI concerning the use of simulation. Panelists will include representatives from ANSYS, Hewlett-Packard Company, Microsoft Corporation and Silicon Graphics, Inc.
The World of Inspiration Expo will provide a great opportunity to learn, get inspired and network with peers as ANSYS and its most valued partners provide hands-on demos, literature and displays of their innovative products. The hands-on area will give attendees the opportunity to work with the full range of software offerings from ANSYS, as well as preview the upcoming ANSYS capabilities. In addition, experts in disciplines from nonlinear, explicit, and fluid structure interaction to full multiphysics, meshing and electronics will be available to consult informally on problem solving and best practices. Formal presentations will be staged in the area as well, providing another opportunity to learn about the latest technology from ANSYS.
Post-conference training, to be held August 28 and 29 at the Westin Convention Center Pittsburgh, will offer insight into products from ANSYS for a variety of advanced analyses. Participants will receive hands-on instruction on topics ranging from combustion modeling to multiphysics.
Sponsors of the 2008 International ANSYS Conference include Intel and SGI (platinum level) as well as Hewlett-Packard, Microsoft, Moldflow, AMD, CEI, Dell and nCode.